It goes without saying that electronic component damage can be caused by general cleanliness, but damage can also be caused by foreign objects too. This is a follow-on blog from our ‘Why and how to maintain general electronics cleanliness’, so, if you haven’t already read that one, it is a good place to start. Electronics foreign object damage is a real concern, so this blog will focus on the importance of avoiding foreign objects and what steps you can take.
Electronic manufacturing requires exacting measures, precision, and accuracy and even the smallest of foreign objects can wreak havoc and cause significant damage and reliability issues of electronic components.
What is foreign object damage?
A foreign object is the presence of particles or materials that shouldn’t be there. Foreign object examples are tiny particles of dust, fibres, food, hair, skin or metallic debris such as lead off-cuts, solder balls, solder splashes, braid wire or brush bristles. The appearance of a foreign object can happen at any point in the manufacturing process, testing and packaging stages.
What damage can foreign objects cause?
The presence of a foreign object can cause immediate damage or can cause damage over time.
- Electrical malfunctions
Foreign objects can disrupt electrical connections, causing short circuits, power fluctuations or complete failures.
- Reliability and lifespan
This is where efficiency and overall performance is affected intermittently and over time.
- Safety risks
In some instances, a foreign object can pose a real safety concern. It could cause short circuits, overheating or electrical shocks either damaging surrounding equipment or endangering users.
There are many examples of serious issues on board aircraft and in vehicles that have been directly attributed to FOD.
How can you avoid foreign object damage?
General cleanliness and diligence are key to avoiding foreign object contamination within your electronic components.
- Transportation and storage
- Use pallets or carriers when transporting between workstations and minimise time outside protective casings.
- Not only will placing items inside a protective casing/bag protect the component from foreign objects, but it will also address electrostatic and generic damage.
- Be mindful of static electricity which can attract dust and particles, using secure storage will help avoid contamination and damage. Read our blog on ‘Significance and prevention of electrostatic discharge in electronic manufacturing’.
- Quality control
- Quality control measures such as optical imaging will help identify foreign objects at key stages.
- Workstation cleanliness
- These areas should always be kept clean and tidy. No food or drink should be consumed at workstations.
- The work station should AT ALL TIMES be kept free of any debris such as component leads, old solder braid, solder splashes etc. In fact any detritus that could find its way onto a board should be removed.
- A clean workstation will also help in locating any off-cuts that have “pinged off” during board assembly/rework or repair.
- Employee education and training
- Education and training are key for many aspects of electronic manufacturing and foreign objects is no different.
- Ensure employees understand what foreign objects are, how they can appear, the consequences of undetected foreign objects and the process for addressing and resolving foreign object damage incidents.
Foreign object damage is another real threat to the quality, reliability and safety of electronic components as well as the vehicle/aircraft they are installed in and can be minimised through basic workstation cleanliness as well as some key specific measures. Failures and recalls can be costly and affect reputation. Whilst good handling and environment management are key, proper storage and transportation are equally important in maximising the components lifespan and overall functionality.
